Features：
The HTX7045 introduces a chip-style construction that represents an advancement over traditional core and bobbin designs. This innovative approach not only reduces the size of the component, but also streamlines it for highly automated manufacturing process, resulting in a more cost-effective solution. The HTX7045 is particularly well suited for use in gate drive circuits and isolated SPI communication in both industrial and automotive applications.
4K VDC Hi-Pot ideal for isolated SPI communication and gate drive applications
Applications include Battery Management Systems and Industrial Networking
4.9 mm creepage and clearance Material Group 1 (CTI > 600)
Insulation level may be Functional, Basic, or Reinforced depending on application variables such as working voltage, pollution degree, OVC, and altitude. Please contact Coilcraft for full details.
Reduced board space compared to traditional core and bobbin types
Cost-effective and fully-automated for the highest quality
AEC-Q200 qualified
