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Market Overview
The global semiconductor market experienced robust recovery in 2024. According to SIA data, worldwide semiconductor sales reached $627.6 billion in 2024, surpassing the $600 billion milestone for the first time with a year-on-year growth of 19.1%.
Double-digit growth is projected to continue through 2025. This rebound is primarily driven by explosive demand from artificial intelligence (AI), high-performance computing (HPC), automotive electronics, and Internet of Things (IoT) devices.
The passive components market demonstrated steady growth. In 2024, the global passive components market reached $39.1 billion, representing a 7.7% increase year-on-year. The Chinese market exceeded RMB 142.3 billion with 15% growth, elevating China's global market share to 44%. The Chinese passive components market is anticipated to surpass RMB 160 billion in 2025.
AI and Advanced Packaging as Core Drivers
AI Server Demand Surge: MLCC consumption per AI server has increased to 8 times that of conventional servers. The AI sector's annual demand growth rate for MLCCs and chip inductors is expected to exceed 30% through 2030. Micron has revised upward its total HBM market size projection to $35 billion and continues to expand production capacity.
Advanced Packaging Technology Breakthroughs: Intel disclosed details of its 18A process node featuring PowerVia backside power delivery technology, delivering performance improvements of up to 4% at equivalent power consumption. TSMC plans to introduce its A16 process in the second half of 2026, also incorporating backside power delivery technology. AT&S's demonstrated 2.5D and 3D heterogeneous integration technologies provide robust support for high-bandwidth AI chips.
